晶圓中心對位系統
永久貼合與對位
客戶要求疊對結果(<1um)
對位完成後
- X方向 Shift 0.91um(29.94-30.85)
- Y方向 Shift 0.96um(29.89-30.85)
左邊對位Mark
右邊對位Mark
激光分離設備
Laser Debond Module
- Footprint-efficient laser with low maintenance and minimum consumables cost
- Minimized handling time by combining laser treatment and wafer separation within one chamber
- Quasi top-hat / line beam profile for limited thermal input during laser treatment
- High throughput capability
Diode end pumped, q-switched and frequency tripled laser with Nd:YAG crystals, with laser head, power supply, chiller：
- wavelength: UV (355nm)
- Pulse repetition rate: from single shot to 10kHz
- Pulse energy from single shot to 10kHz : 3mJ
- Pulse length: 10ns
- max average power at 10kHz: 30W
- Beam profile: flat Top-hat
- Scan lens: F580mm, for scanning area of 320x320, WD 670mm
