Wafer Temporary Bonding Process Flow(Single Layer)
2Wafer Temporary Bonding Process Flow(Dual Layer)
200~300mm Wafer Temporary Bonding& Indirect permanent bonding
規格
- EFEM Robot / Pre-aligner / Loasport/FFU
- Glue / Wax / Epoxy Coating with Hot plate
- Thermal / UV cure with Vacuum Bonder
- 高真空室 / 高結合力 / 高溫加熱器
